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0 1 f o 1 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 preliminary data sheet PH5502B2NA1-E4 ambient illuminance sensor des cript ion t h e ph55 0 2 b 2 na1 - e 4 i s a n a m b i e n t illu min an ce s e n s or w ith a pho to d iod e and curren t a m p lifier. t h is produ ct h as s p ectral c h aracteristics clo se t o hum a n eye sen sitiv ity a n d out puts lig h t c u rren t propo rtio n al t o t h e amb ien t b r i g h t n ess. the p h55 0 2 b 2 na1 - e 4 can b e u se d to i m prove t h e p er f orm ance a n d red u c e t h e p o w e r c o n su m p tio n o f d i g ital equi p m ent such as f p d-t v s et s and m obile p h o n es, b y e n ablin g aut o m at i c brigh t n e ss c ont rol a n d aut o m atic switch i ng o n a n d o ff o f lighting s y s t e m s. fea t ure s ? s m a ll a nd t h i n s o n p acka g e 2 . 5 5 x 1 . 5 6 x 0 . 5 5 m m ? s p ectral c h aracteristics clo se t o h u m a n eye sen sitiv ity p eak s en sitiv ity w av elengt h 5 5 5 n m typ. ? o u t put c h aracteristics p r o p ort i onal to illu m i n an ce ? large o u tpu t light c u rre n t 2 3 0 a typ.@100 lx (fl u ores cen t lig h t ) ? low voltag e o p eration v cc = 1 . 8 t o 5 . 5 v ? pb -f ree applications ? fpd t v sets, displays ? m obile p h o n e s , sm art pho nes ? n o teb ook pcs, tab l et pcs ? dscs, dvcs ? fa e q u i p m ent ? lighting syste m s, etc. r08 d s0 038e j01 00 rev.1.00 oct 05, 201 1 a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 2 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 package dimensions (unit: mm) 1 3 6 4 bottom view top view side view (0.25) 5 . 0 5 5 . 0 0.2 0.22 0.2 1.560.15 2.550.2 2.25 2 5 remark pin 1 is distinguishab le b y the shape of the lead fr ame . remark ( ) indicates nominal dimensions. pin no. t e rmina l 1 out 2 gnd 3 v c c 4 nc 5 nc 6 nc rema r k 1. connect al l the nc terminal s to gnd or v c c . 2. t he b y p a s s capacitor b e t w een v c c a nd g nd is to be m o unted w i t h in 20 mm o f the package b o d y . a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 3 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 b lock d i a gram o u t l i g h t s o u rce gn d v c c marking exampl e (bottom view) 1 pin assembly code product code a 2 a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 4 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 absolute maximum ratings (t a = 25 c, unless otherw ise specified) para mete r symbol ratings unit v e g a t l o v y l p p u s c c 6 v i t n e r r u c t h g i l o 5 ma p o w e r diss i pat ion *1 p d 135 m w o per a t i n g t e m per a t u r e t opt ? 30 to + 85 c storage t e mperature t s t g ? 40 to + 100 c note: *1. mounte d on g l ass epo xy b oar d (18 mm 13 mm t 0.8 mm) recommended operating conditions para mete r symbol min . t yp. m a x. unit v e g a t l o v y l p p u s c c 1.8 3.0 5.5 v electro-optical charac t e ristics ( t a = 25 c, v cc = 3.0 v, unless otherw ise specified) pa rame ter sy mbol condit i ons min. typ. m a x. unit supp l y curre n t * 1 i c c e v = 100 l x * 2 ? 260 ? a peak sens itivit y w a vel e n g th p ? 555 ? nm light c u rrent * 1 i o 0 e v = 0 lx ? 0.1 a i o 1 e v = 10 l x * 2 ? 23 ? a i o 2 e v = 100 l x * 3 ? 330 ? a i o 3 e v = 100 l x * 2 195 230 265 a saturation output voltage * 4 v o e v = 100 lx, r l = 150 k * 2 2.6 2.9 ? v s w itc h i n g rise t i me t r r l = 5 k * 6 ? 200 s t i me * 5 fall t i me t f ? 250 s dela y t i me t d ? 400 s storage t i me t s ? 10 s not e : * 1 m easu re d u nde r loa d r e s i sta n c e con d i ti o ns o f an outp u t cu rrent unsa tu r a ted * 2 f l uoresce n t lig h t * 3 incand escent l i ght *4 saturatio n outp u t voltage measurement meth od: light source illuminance (lx) v cc ph5502b gnd out r l v cc v cc v o a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 5 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 * 5 s w itc h i n g t i me pulse input input output v cc ph5502b gnd out r l v cc t d t s 90% 10% t r t f * 6 w h ite led a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 6 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 typical charac t e ristics (t a = 25 c, v cc = 3.0 v, unless otherw ise specified) 1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 2 5 . 1 1 5 . 0 0 0 0 9 0 0 8 0 0 7 0 0 6 0 0 5 0 0 4 0 0 3 1 000 1 100 1 200 0 0.2 0.4 0.6 0.8 1 1.2 ? 90 ? 60 ? 30 0 30 60 90 0 0.2 0.4 0.6 0.8 1 1.2 ? 90 ? 60 ? 30 0 30 60 90 o i t a r ) m n ( h t g n e l e v a w ) . g e d ( e l g n a ) . g e d ( e l g n a ratio ratio ratio 1 pin 1 pin white led krypton light halogen light incandescent light fluorescent light + + - - spectral sensitivity characteristics directional characteristics 1 directional characteristics 2 light source sensitivity variation rem ark t he graphs i ndic a te nomi nal c h arac teristics. a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 7 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 0 0.2 0.4 0.6 0.8 1.2 1 1.4 ? 40 0 0.01 0.1 1 0.001 2 v cc (v) ratio ratio ? 40 ? 20 0 20 40 60 80 100 ? 20 0 20 40 60 80 100 0.2 0.4 0.6 0.8 1 1.2 1.4 2.533.544.555.5 6 0.1 1 10 100 1 000 10 000 0.1 1 10 100 1 000 10 000 illuminance (lx) a b c at 100 lx (normalized at v cc = 3 v) v cc dependency of light current current at 100 lx (normalized at 25 c) temperature dependency of light of light current at 0 lx temperature dependency i o ( a) i o ( a) light current vs. illuminance load between out-gnd a: no load c: 10 k b: 1 k temperature ( c) temperature ( c) rem ark t he graphs i ndic a te nomi nal c h arac teristics. a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 8 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 taping specifications (unit: mm ) o utline and dimensions (tape) t a p e direction o utline and dimensions (reel) symbol dimensions (mm) a b w symbol dimensions (mm) c d e 130.2 2.00.5 21.00.8 180 +0 ?1.5 60 +1 ?0 9.0 +1 ?0 1 2 e w d c b a 2 1 perforation direction of feed product carrier tape cover tape product pin 1 2.00.1 5 0 . 0 2 . 0 1 . 0 0 . 4 0.780.05 3.50.05 1.750.1 8.00.2 0.780.05 2.9 1.95 4.00.1 1.050.05 1.5 +0.1 ?0 90 120 a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 9 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 recommended mount pad dimens ions (unit: mm) 0.24 0.24 0.22 0.5 0.5 0.5 0.5 0.22 0.22 0.22 1.85 0.55 remark all dimensions in this figure m ust be e v aluated bef ore use . a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
ph55 02 b2 na1 - e4 chap ter title 0 1 f o 0 1 e g a p 0 0 . 1 . v e r 0 0 1 0 j e 8 3 0 0 s d 8 0 r oct 05, 2011 notes on handling 1 . r ecommended refl o w s o l d eri n g c ond itions (inclu din g i n frared re flo w , c o nvectio n refl o w , a n d in fra re d + co n v ection r eflo w ) (1) this product is dry-pac k e d with de siccan t in order to a v oid m o isture abs o rption. ( 2 ) aft er b r e a k ing t h e seal , refl o w sol d ering m u s t be d o ne w ith i n 1 6 8 h o u r s u n d e r t h e recom m ended t em p erat ure p r ofile s h o w n below. ( 3 ) if m o re t h a n 1 6 8 h o u r s h a ve passe d a f t er b r eaking t h e seal , t h e b a k i n g p r ocess m u s t b e d o ne b y using a t ape a n d reel. bak ing c o n d itio n s : o n ce, w i t h tap e and r eel, 6 0 5 c, 1 0 t o 2 4 h our s a fter t h e b a k i n g p r o cess, t h i s p r o d u ct m u s t be s t ore d u nde r c o n d itio n s of 3 0 c o r bel o w , 7 0 % r h o r bel o w , a n d r e f low sol der i n g m u s t b e d one w ith i n 1 6 8 h o urs . < st o r a g e c o n d i tions a f t er b re a k i n g seal > ? 0 3 : s n o i t i d n o c e g a r o t s c or below, 7 0 % r h o r below ? m ax i m u m s t orage peri o d aft e r brea k i n g seal : 1 6 8 h o u r s (se co n d refl o w s old ering m u s t b e com p l et ed w ith i n 1 6 8 hour s.) < reflow s o l d ering c o n d itio n s > ? 0 6 2 : e r u t a r e p m e t w o l f e r k a e p c or below (packa g e s u rface tem p erature) ? 2 : s w o l f e r f o r e b m u n m u m i x a m ? n o r e pai r b y h an d s o l deri ng ? m ax i m u m chl o r i ne c o n t ent of rosi n f lux ( p e r cent age m ass) : 0 . 2% o r l ess time recommended temperature profile of reflow package surface temperature 60 to 120 s 220c 255c 8 min. max. 150c ramp-up rate 3 c/s max. ramp-down rate 6 c/s max. peak temperature 260c max. 30 s or less 60 s or less 200c a bu s i n e ss par tne r o f r e n esas elec t ro nics c orp o r a tio n .
all trademarks and registered trademarks are t he property of their respective owners. c - 1 revision history ph5502b 2na1-e4 data sheet description rev. date page summary 1.00 oct 05, 2011 ? first edition issued
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